In the process of IC manufacturing, dies are bonded with the gold wires that are thinner than human hair on the substrates. The layout and the electrical connection for the wire bonding are implanted by machines controlled by programs.
When wire bonding is finished, it is required to examine the quality of the bonding and to confirm the wires are connected to corresponding positions on the substrates. Usually, quality assurance personnel adopt the electron microscopes, metallurgical microscopes, or other instruments to do the quality inspection. However, it is not easy to preserve the images during the inspection process.